Described herein are processing techniques for fabrication of stretchable and/or flexible electronic devices using laser ablation patterning methods. The laser ablation patterning methods allow for efficient manufacture of large area (e.g., up to 1 mm.sup.2 or greater or 1 m.sup.2 or greater) stretchable and/or flexible electronic devices, for example manufacturing methods permitting a reduced number of steps.

The techniques further provide for improved heterogeneous integration of components within an electronic device, for example components having improved alignment and/or relative positioning within an electronic device. Also described are flexible and/or stretchable electronic devices, such as interconnects, sensors and actuators.