UIUC Office of Technology Management
Published on UIUC Office of Technology Management (https://origin.otm.illinois.edu)

Home > Metal Complexes for Depositing Metal-Containing Th...(TF07036)

Metal Complexes for Depositing Metal-Containing Thin Films

Metal Complexes for Depositing Metal-Containing Th...(TF07036) [1]

 

This technology is a family of metal complexes that can be used for depositing metal compounds.

John
Abelson

Inventors:

US Pat #: 
8362220
Issue Date: 
1/29/2013
The Office of Technology Management
319 Ceramics Building
105 South Goodwin Avenue
Urbana, IL 61801
Phone: 217.333.7862
Fax: 217.265.5530
Email: otm@illinois.edu

Source URL:https://origin.otm.illinois.edu/technologies/metal-complexes-depositing-metal-containing-thtf07036

Links
[1] https://origin.otm.illinois.edu/technologies/metal-complexes-depositing-metal-containing-thtf07036